Ontrack With Judy Warner

Join Tech Consultant Zach Peterson as he chats with Tony Lentz, Chemist and Field Application Engineer with FCT Assembly, about the latest innovations in solder paste for ultra-high density interconnects (UHDI) and the challenges of working with smaller solder powder sizes. The pair also discusses the role of AI in electronics manufacturing and the future of PCB assembly. Tony brings his deep knowledge of materials science and the chemistry of electronics to this insightful discussion, providing valuable perspectives on industry trends and advanced packaging techniques. Tune in to learn about the exciting developments shaping the future of electronics manufacturing.